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公司名稱:昆山佰易儀器設備有限公司

Company name : KunShan BaiYi Instrument Equipment Co.,Ltd

公司地址:江蘇省昆山市牧野路99號3號房

Add:3# Building No.99,Muye Road ,Yushan Town ,Kunshan City ,Jiangsu,China

聯系電話Tel:0512-57991570

電子信箱Email:[email protected]
[email protected]

聯 系 人 Contacts:高先生

手機號碼 Cell phone:18606297225 

點膠機產品GLUE DISPENSING MACHINE
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    >>點膠機產品GLUE DISPENSING MACHINE
  • 桌上型視覺伺服點膠機 Desktop CCD Servo Glue Dispensing Robot

     

     技術參數:Specification  

    型號(Model)

    BY-4500EDS

    BY-5500EDS

    工作范圍(Work Area

    400(X)400(Y)100(Z)mm

    500(X)500(Y)100(Z)mm

    外觀尺寸(Size)

    590(L)*740(W)*681(H)mm

    690(L)*840(W)*681(H)mm

    最大負載Y/Z(Max load)

    20kg/10kg

    最大空移速度(Travel speed)

    400mm/sec(XY)/200mm/sec(Z)

    軸傳動方式(Drive mode)

    伺服馬達/滾珠絲桿+精密直線導軌(Servo motor/ball screw+linear guide rail)

    XYZ定位精度(Repeatability )

    ±0.02mm

    程序儲存容量(Program capacity)

    999個參數文件(每個文件65535)(999 parameter files(65535 points per file))

    操作系統(Operation  system )

    液晶面板/手持式編程器(LCD panel /Teach pendant)

    運動模式(Movement pattern)

    3軸點到點、連續直線、圓孤(3 axis point to point,continuous line, arc)

    擴展IO(I/O signal ports)

    4輸入/4輸出(4 inputs/4 outputs)

    輸入電源(Power supply)

    AC220V 50/60HZ 0.7KW

    工作環境(Work condition)

    溫度0-40 相對溫度20-90%(Temperature 0-40℃;humidity 20-90%)

    重量(Weight)

    45KG(About45KG)

    55KG(About55KG)

     應用:Application

    1.適用流體點膠,例如: UV膠、AB膠、EPOXY(黑膠)、白膠、EMI導電膠、SILICON、環氧樹脂、瞬間膠、

    銀膠、紅膠、錫膏、散熱膏、防焊膏、透明漆、螺絲固定劑等;

    It is applied to fluid dispensing, such as, UV glue, AB glue,COB(black glue), white glue, EMI conductive

    glue, silicon, epoxy resin, instant glue, silver glue, red glue, paste, thermal grease, welding control paste,

    transparent paint, screw fixative and so on.

    2. 應用于PCB電子配件固定及保護,手機、筆記本外殼粘接,LCD玻璃,LED點膠,雙攝像頭點膠與封裝,指紋模組點膠,汽車配件涂覆,芯片綁定,電池封裝,喇叭點膠,SMT底部填充、元件封裝、點錫膏、點紅膠、點黑膠、半導體封裝、晶元固定等

    Applied to PCB electronic accessories fixed and protection, and mobile phone, notebook shell adhesive, LCD glass, LED point glue, dual cameras dispensing with encapsulation, fingerprint module point glue, auto parts coated, chip binding, battery encapsulation, horn point glue, SMT at the bottom of the filling, packaging, dispensing, points the red plastic, vinyl, semiconductor packaging, wafer fixed and etc .

     

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